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Blu-Si, Inc Blu-Si, Inc. is a silicon micromachining, microfabrication company that provides custom product development and process development for the microtechnology market. Rapid turnaround of custom prototypes -- Low volume production runs -- Delivering results at a lower cost. Products Blu-Si offers two types of products: Custom and 'off-the-shelf' The bulk of our business is doing custom work, but currently we offer pre-made wire bond test wafers to IC packaging facilities worldwide. Additionally we will fabricate custom patterns. We anticipate soon introducing a Microstructure Optical Switching Device. Services Using IC technology and equipment, Blu-Si is able to miniaturize discrete components onto a wafer-scale process fully customizable to individual requirements. Significant cost reductions can be realized through our wafer-scale processing. On a single substrate, we are able integrate multiple functions to increase the functionality and still reduce the overall size of the device. Solutions Blu-Si attracts clients that require a variety of expertise and novel solutions relating to Silicon Micromachining. The scope of our clients spans start-ups to multi-national corporations. Solutions for our clients can be simple silicon micromachining or thin films services, to fabricating more complex biomedical devices and planar waveguides. BioMEMS BioMEMS (Biological Micro-Electro-Mechanical Systems) is the practice of combining biological systems with MEMS technology. Blu-Si, Inc. is a silicon micromachining, microfabrication company that provides custom product development and process development for the microtechnology market. Blu-Si The scope of our clients spans start-ups to multi-national corporations. Solutions for our clients can be simple silicon micromachining or thin films services, to fabricating more complex biomedical devices and planar waveguides. Some of the biomedical applications that we have worked on include: Projects underway include microfluidic systems and chemical analysis systems. microchannels, microfilters, valves, microarrays, microelectrodes, and hermetically sealed devices. Blu-Si is a highly responsive company dedicated to creating silicon micromachining solutions where customized design, low production volume, personalized service and fast turnaround are essential to the success of your product development program. Blu-Si brings you flexibility, experience and proven customer satisfaction. MEMS Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through the utilization of microfabrication technology. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components are fabricated using compatible micromachining processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices. micro optical electro mechanical systems New clients often come to Blu-Si with a similar challenge: We need a device that fits into a specific package for a unique application. What can you do for us? The customer could be in the bio-medical industry, or have fiber optics applications for the telecommunications industry-or any field that can benefit from MEMS, BioMEMS or MOEMS. Our answer is based on years of experience: We can take your project from the design and development stage to prototyping to production runs all under one roof. microelectromechanical systems Our facility is fully equipped to handle all processing steps involved with microfabrication starting with photolithography, micromachining (surface and bulk), thin film deposition and packaging. Significant cost reductions can be realized through our wafer-scale processing. microfabrication Microfludics take advantage of the chemical properties of liquids and gases and the electrical properties of semiconductors and combine them on a single chip. The minuscule systems, whose dimensions are measured in nanometers, perform tasks that range from detecting airborne toxins to analyzing DNA sequences. The devices offer several advantages over conventionally sized systems, including compact size, disposability, increased functionality, and they require smaller volumes of reagents and samples. microfludics Microlithography seeks to create smaller and smaller features on integrated circuits(IC). Using IC technology and equipment, Blu-Si is able to miniaturize discrete components onto a wafer- scale process fully customizable to individual requirements. Significant cost reductions can be realized through our wafer-scale processing. On a single substrate, we are able integrate multiple functions to increase the functionality and still reduce the overall size of the device. microfluidics Micromachine technology is an emerging high-technology. Though micromachines are small, they have tremendous potential for society in the 21st Century. The technology is indispensable for the biomedical field supporting an elderly society and for the information technology (IT) used in a highly networked society. Blu-Si, Inc. is a silicon micromachining, microfabrication company that provides custom product development and process development for the microtechnology market. microlithography Currently, we are fabricating a novel microstructure optical switch for the telecommunication industry. Relay matrix, optical switch, optical modulator, optical bench and optical connectors. micromachine technology MicroOptics is a component of micro optical electro mechanical systems (MOEMS). MicroOptics technology utilizes micromachines that manufacture mechanical structures in the micron to millimeter range. When you mix micro-machined devices with MicroOptics, MOEMS technology is the result. micromachining It would be hard to match the level of knowledge and experience that we maintain in-house. Our staff includes people with backgrounds in chemical and electrochemical engineering who specialize in fluid dynamics simulation, as well as electrical and biochemical engineering. And, Blu-Si's location puts us right in the thick of things. Stanford and many MEMS companies are situated nearby. MicroOptics The 'off-the-shelf' Products at Blu-Si includes a Microstructure Optical Switch. The optical switch, by definition, switches optical wavelengths. The most common use for the optical switch is to increase network bandwidth. Blu-Si offers two types of products: Custom and 'off-the-shelf' The bulk of our business is doing custom work, but currently we offer pre-made wire bond test wafers to IC packaging facilities worldwide. Additionally we will fabricate custom patterns. MOEMS There are a number of basic techniques that can be used to pattern thin films that have been deposited on a silicon wafer, and to shape the wafer itself, to form a set of basic microstructures (bulk silicon micromachining). Electrochemical etching techniques are being investigated to extend the set of basic silicon micromachining techniques. Silicon bonding techniques can also be utilised to extend the structures produced by silicon micromachining techniques into multilayer structures. optical switch Client B needed to scale down a microfluidic component, but at the same time maintain the functionality of the device. The project was successful and Blu-SI was awarded the next phase which includes the integration of a pressure sensor. silicon micromachining Client A has their own facility for research and development but was lacking internal resources for delivering production level parts on a timely schedule. Blu-Si designed a process for fabricating Bell Core qualified parts on a quick turn arrangement. We met our client's specification, cost parameters and delivered on time. Wire Bond Test Die Universal Wire Bond Test Wafer is designed for System In Package (SIP) construction validation. This test wafer is a low cost alternative for qualifying package design, for testing reliability, for environmental stress testing and evaluating small bumps. Other setups include long wire and low loop wire bonding. The 100 mils X 100 mils die size is versatile in its offering of various standard pad sizes and pitches including 40 microns pitch layout, stagger and linked pads. Our design can be used for SIP packages that are cross, small die on large die and large die on small die. The Universal Wire Bond Test Wafer is available with or without passivation. Custom metal pads and passivation are available upon request. |