Wire Bond Test DieUniversal Wire Bond Test Wafer is designed for System In Package (SIP) construction validation. This test wafer is a low cost alternative for qualifying package design, for testing reliability, for environmental stress testing and evaluating small bumps. Other setups include long wire and low loop wire bonding. The 100 mils X 100 mils die size is versatile in its offering of various standard pad sizes and pitches including 40 microns pitch layout, stagger and linked pads. Our design can be used for SIP packages that are cross, small die on large die and large die on small die. The Universal Wire Bond Test Wafer is available with or without passivation. Custom metal pads and passivation are available upon request.Blu-SiBlu-Si, Inc. is a silicon micromachining, microfabrication company that provides custom product development and process development for the microtechnology market.Our clients range from start-ups to multi-national corporations. Our solutions can be as straightforward as basic silicon micromachining and thin films services, or as complex as the full fabrication of v- grooves, optical platforms and more in production quantities. The common thread is that Blu-Si will save you time and money while helping you build competitive products. You'll find more information about Wire Bond Test Die |